Technical characteristics
Design according
|
PICMG AMC.0
(RoHS compliance) | ||||||||||
|
|||||||||||
Number of contacts
|
170 | ||||||||||
Contact spacing
|
0.75 mm
| ||||||||||
Clearance and creepage
distance between contacts |
0.1 mm min. | ||||||||||
|
| ||||||||||
Working current of
|
~ 2.9 A
@ 70 °C
| ||||||||||
power contact as defined in AMC.0 spec.
|
max. 30 °C temp. rise
(PICMG requirement min. 1.52 A) | ||||||||||
Test voltage
|
80 Vr.m.s.
| ||||||||||
Working voltage typically
|
3.3 V; 5.0 V; 12.0 V | ||||||||||
Initial contact resistance
|
|||||||||||
ground contact
|
60 mΩ max.
| ||||||||||
signal, power, general
|
| ||||||||||
purpose contacts
|
90 mΩ max.
| ||||||||||
Initial insulation resistance
|
100 MΩ min.
| ||||||||||
|
| ||||||||||
Nominal differential impedance |
100 Ω ± 10 % | ||||||||||
|
|||||||||||
Differential propagation delay |
| ||||||||||
Differential skew |
| ||||||||||
Temperature range | -55°C ... +125 °C | ||||||||||
Durability as per AMC.0 specification |
200 mating cycles in total | ||||||||||
Termination technique | Press-in termination | ||||||||||
Mating force |
100 N max., typically 65 - 90 N (depending on AdvancedMC TM) | ||||||||||
Withdrawal force |
65 N max., typically 30 - 45 N (depending on AdvancedMC TM) | ||||||||||
Materials
|
|||||||||||
Mouldings |
Liquid Crystal Polymer (LCP), UL 94-V0 | ||||||||||
Contacts | Copper Alloy | ||||||||||
Contact surface | Palladium nickel plated | ||||||||||
Packaging | Card box (other packaging on request) |
Recommended plated through hole specification
Tin plated PCB (HAL) | Hole Ø | 0.64±0.01 mm |
Cu | 25 – 35 μm | |
Sn | 5 – 15 μm | |
Plated hole Ø | 0.53 – 0.60 mm | |
Au / Ni plated PCB | Hole Ø | 0.64±0.01 mm |
Cu | 25 – 35 μm | |
Ni | 3 – 7 μm | |
Au | 0.05 – 0.12 μm | |
Plated hole Ø | 0.55 – 0.60 mm | |
Chemical tin plated PCB | Hole Ø | 0.64±0.01 mm |
Cu | 25 – 35 μm | |
Sn | 0.8 – 1.5 μm | |
Plated hole Ø | 0.56 – 0.60 mm | |
Silver plated PCB | Hole Ø | 0.64±0.01 mm |
Cu | 25 – 35 μm | |
Ag | 0.1 – 0.3 μm | |
Plated hole Ø | 0.56 – 0.60 mm | |
OSP copper plated PCB | Hole Ø | 0.64±0.01 mm |
Cu | 25 – 35 μm | |
Plated hole Ø | 0.56 – 0.60 mm |
Based on our experiences regarding the production process of the PCB manufacturer we recommend a plated through hole configuration like shown in the above spreadsheet. To achieve the recommended plated through hole diameter, it is important to specify especially the drilled hole diameter of 0.64±0.01 mm to your PCB supplier.
For drillings use e.g. drill bit # 72 (0.025" ≈ 0.64 mm).
Harting - Top Industrial Connectors Electronic Connectors Manufacturer in German
0 comments:
Post a Comment