Technical characteristics
Design acc. to | OBSAI System Spezifikation V 1.1 | ||
Number of contacts | up to 4 | ||
Contact spacing | 3.00 mm | ||
Clearance and creepage | |||
distances between contacts | > 2.3 mm | ||
Working current | 23 A max. (OBSAI configuration) | ||
20 A max. (fully loaded with power contacts) | |||
Test voltage U r.m.s. | AC 1500 V min. | ||
Contact resistance | < 1 mΩ | ||
Insulation resistance | > 10 GΩ | ||
Temperature range | - 55 °C ... + 125 °C | ||
Reflow temperature | 220 °C for 2 minutes, 260 °C max. short-term | ||
Durability as per | Performance level 2 = 250 mating cycles in total. | ||
IEC 61 076–4–101 | First 125 mating cycles, then 4 days gas test using 0.5 ppm SO2 and 0.1 ppm H2S (at 25 + 2 °C and 75 + 3 % humidity). Measurement of contact resistance. | ||
The remaining 125 mating cycles are subject to measurement of contact resistance and visual inspection. No abrasion of the contact finish through to the base material. No functional impairment. | |||
Termination technique | |||
Male connectors | Press-in or solder termination, suitable for (lead-free) pin-in-hole reflow soldering | ||
Female connectors | Press-in terminantion | ||
Mating force | max. 4 N / contact | ||
Withdrawal force | min. 0.5 N / contact | ||
Materials | |||
Mouldings | Thermoplastic resin, glass-fibre filled, UL 94-VO | ||
Contacts | Copper alloy | ||
Contact surface | Selectively gold plated (contact zone) | ||
Contact styles | Standard, leading, lagging | ||
Packeging | |||
Tube | Male and female connectors | ||
Tape & Real | On request for male solder connectors |
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