AdvancedMC(TM) connector for MicroTCA(TM) Technical characteristics

Technical characteristics

Design according	PICMG MTCA.0 R1.0 (RoHS compliance)
Number of contacts	170
Contact spacing	0.75 mm
Clearance and creepage distance between contacts	0.1 mm min.
Working current of	~ 2.3 A @ 70 °C
power contacts	max. 30 °C temp. rise
as defined in MTCA.0 spec.	(PICM requirement min. 1.52 A)
Test voltage	80 Vr.m.s.
Working voltage typically	3.3 V; 5.0 V; 12.0 V
Initial contact resistance	25 mΩ max.
Initial isulation resistance	100 MΩ min.
Nominal differential impedance	100 Ω ± 10 %
Max. NEXT @ 25 ps risetime Bottom route Adjacent 0.65 % Basic-to-extended (diagonal) 0.60 % Basic-to-extended (opposite) 0.73 % Multiline (five multi-aggressor differential pairs) 2.88 % max.
PCB library on request (PADS/Dx-Designer) SPICE models and S-Parameter on request
Differential propagation delay	Basic side: 70 ps + 5 ps Extended side: 70 ps + 5 ps
Differential skew	Between basic and extended side:   + 2 ps Within basic and extended side:   + 2 ps
Temperature range	-55°C ... +105 °C
Durability as per MTCA.0 spec.	200 mating cycles
Termination technique	Press-in termination
Mating force	100 N max., typically 60 - 80 N
	(depending on AdvancedMCTM)
Withdrawal force	65 N max., typically 40 - 60 N
	(depending on AdvancedMCTM)
Materials
Moulded parts	Liquid Crystal Polymer (LCP), UL 94-V0
Contacts	Copper Alloy
Contact surface	Pd/Ni with Au flash
	Au over Ni on request
Packaging	Cardboard box (other packaging on request)

  Recommended plated through hole specification

	A	Drill hole-Ø	0.64±0.01 mm
	B	Cu	25 – 35 μm
Tin plated PCB (HAL)	C	Sn	5 – 15 μm
	D	Hole-Ø	0.53 – 0.60 mm
Au / Ni plated PCB	C	Ni	3 – 7 μm
		Au	0.05 – 0.12 μm
	D	Hole-Ø	0.55 – 0.60 mm
Chemical tin plated PCB	C	Sn	0.8 – 1.5 μm
	D	Hole-Ø	0.56 – 0.60 mm
Silver plated PCB	C	Ag	0.1 – 0.3 μm
	D	Hole-Ø	0.56 – 0.60 mm
OSP copper plated PCB	C	---	---
	D	Hole-Ø	0.56 – 0.60 mm
	E	Pad size	min. 0.95 mm

The press-in zone of the AdvancedMC ™ connector is tested according to Telcordia/Bellcore GR 1217CORE Part7. It is approved to be used with a plated through hole according IEC 60352-5 with a diameter of 0.55±0.05 mm (drilled hole 0.64±0.01 mm).
Based on our experiences regarding the production process of the PCB manufacturer we recommend a plated through hole configuration like shown in the above spreadsheet. To achieve the recommended plated through hole diameter, it is important to specify especially the drilled hole diameter of 0.64±0.01 mm to your PCB supplier.

For drillings use e.g. drill bit # 72 (0.025" ≈ 0.64 mm).

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