Friday, July 20, 2012

AdvancedMC(TM) connectors for AdvancedTCA® Technical characteristics


Technical characteristics




Design according
PICMG AMC.0
(RoHS compliance)

Number of contacts
170
Contact spacing
0.75 mm
Clearance and creepage
distance between
contacts


0.1 mm min.


Working current of
~ 2.9  A @ 70 °C
power contact as defined in AMC.0 spec.
max. 30 °C temp. rise
(PICMG requirement min. 1.52 A)
Test voltage
80 Vr.m.s.
Working voltage typically
3.3 V; 5.0 V; 12.0 V
Initial contact resistance
ground contact
60 mΩ max.
signal, power, general

purpose contacts
90 mΩ max.
Initial insulation resistance
100 MΩ min.


Nominal differential
impedance

100 Ω ± 10 %
Max. crosstalk @ 25 ps risetime Bottom route
Adjacent 0.55 %
Basic-to-extended (diagonal) 0.68 %
Basic-to-extended (opposite) 0.39 %
Multiline (five multi-aggressor differential pairs)
2.74 % max.
Differential propagation
delay
Basic side: 125 ps
Extended side: 145 ps
Differential skew
Between basic and
extended side:

20 ps
Within basic and
extended side:
 
+
2 ps
Temperature range -55°C ... +125 °C
Durability as per
AMC.0 specification

200 mating cycles in total
Termination technique Press-in termination
Mating force 100 N max., typically 65 - 90 N
(depending on AdvancedMC TM)
Withdrawal force 65 N max., typically 30 - 45 N
(depending on AdvancedMC TM)
Materials
Mouldings Liquid Crystal Polymer
(LCP), UL 94-V0
Contacts Copper Alloy
Contact surface Palladium nickel plated
Packaging Card box (other packaging on request)
 
Recommended plated through hole specification
Tin plated PCB (HAL) Hole Ø 0.64±0.01 mm
Cu 25 – 35 μm
Sn 5 – 15 μm
Plated hole Ø 0.53 – 0.60 mm
Au / Ni plated PCB Hole Ø 0.64±0.01 mm
Cu 25 – 35 μm
Ni 3 – 7 μm
Au 0.05 – 0.12 μm
Plated hole Ø 0.55 – 0.60 mm
Chemical tin plated PCB Hole Ø 0.64±0.01 mm
Cu 25 – 35 μm
Sn 0.8 – 1.5 μm
Plated hole Ø 0.56 – 0.60 mm
Silver plated PCB Hole Ø 0.64±0.01 mm
Cu 25 – 35 μm
Ag 0.1 – 0.3 μm
Plated hole Ø 0.56 – 0.60 mm
OSP copper plated PCB Hole Ø 0.64±0.01 mm
Cu 25 – 35 μm
Plated hole Ø 0.56 – 0.60 mm
The press-in zone of the AdvancedMC ™ connector is tested according to Telcordia/Bellcore GR 1217CORE Part7. It is approved to be used with a plated through hole according IEC 60352-5 with a diameter of 0.55±0.05 mm (drilled hole 0.64±0.01 mm).
Based on our experiences regarding the production process of the PCB manufacturer we recommend a plated through hole configuration like shown in the above spreadsheet. To achieve the recommended plated through hole diameter, it is important to specify especially the drilled hole diameter of 0.64±0.01 mm to your PCB supplier.

For drillings use e.g. drill bit # 72 (0.025" ≈ 0.64 mm).
















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