Power connectors for Advanced TCA® Technical characteristics

Technical characteristics

Design according	PICMG 3.0 R2.0
Total number of contacts	30, max. 34
Power contact	8
Signal contact	22, max. 26
Clearance and creepage distance between contacts
Within group 5-16	0.7 mm min.
Within group 17-24	2.5  mm min.
25 to 26	5.5 mm min.
Within group 27-34	1.4 mm min.
13-16 to 17-20	3.0 mm min.
21-24 to 25-26	4.0 mm min.
25-26 to 27-29	2.0 mm min.
Sequential contact engagement
1st	25, 26, 28, 29, 30, 31
2nd	33
3rd	5-24, 34
4th	27, 32
Working current
Power contact	16 A
Signal contact	1 A
Test voltage
Contact 1-16	1000 Vr.m.s.
Contact 17-34	2000 Vr.m.s.
Initial contact resistance
Power contacts	< 2.2 mΩ
Signal contacts	< 8.5 mΩ
Insulation resistance	> 108 Ω
Temperature range	-55°C ... +125 °C
Durability	250 mating cycles
Termination technique	Press-in termination
Mating force	67 N max.
Withdrawal force	67 N max.
Derating for ATCA® power contacts Contact loading acc. PICMG 3.0
(1) Derating (2) Derating @ Imax. x 0.8     (acc. IEC 60 512-5-2)
Materials
Moulded parts	PBT, glass-fibre filled, UL 94-V0
Contacts	Copper Alloy
Contact surface	Selectively gold plated
Packaging	Tray packaging (other packaging on request)

  Recommended plated through hole specification

		Signal contacts	Power contacts
Tin plated PCB (HAL)	Hole Ø	1.15±0.025 mm	1.75±0.025 mm
	Cu	25 – 35 μm	25 – 35 μm
	Sn	5 – 15 μm	5 – 15 μm
	Plated hole Ø	1.00 – 1.10 mm	1.60 – 1.70 mm
Au / Ni plated PCB	Hole Ø 0.64	1.15±0.025 mm	1.75±0.025 mm
	Cu	25 – 35 μm	25 – 35 μm
	Ni	3 – 7 μm	3 – 7 μm
	Au	0.05 – 0.12 μm	0.05 – 0.12 μm
	Plated hole Ø	1.00 – 1.10 mm	1.60 – 1.70 mm
Chemical tin plated PCB	Hole Ø	1.15±0.025 mm	1.75±0.025 mm
	Cu	25 – 35 μm	25 – 35 μm
	Sn	0.8 – 1.5 μm	0.8 – 1.5 μm
	Plated hole Ø	1.00 – 1.10 mm	1.60 – 1.70 mm
Silver plated PCB	Hole Ø	1.15±0.025 mm	1.75±0.025 mm
	Cu	25 – 35 μm	25 – 35 μm
	Ag	0.1 – 0.3 μm	0.1 – 0.3 μm
	Plated hole Ø	1.00 – 1.10 mm	1.60 – 1.70 mm
OSP copper plated PCB	Hole Ø	1.15±0.025 mm	1.75±0.025 mm
	Cu	25 – 35 μm	25 – 35 μm
	Plated hole Ø	1.00 – 1.10 mm	1.60 – 1.70 mm

The press-in zone of the AdvancedTCA® power connector is tested according to Telcordia/Bellcore GR 1217CORE Part7. It is approved to be used with a plated through hole according IEC 60352-5 with a diameter of 1.00 + 0.09 – 0.06 mm for signal contacts and 1.60 + 0.09 – 0.06 mm for power contacts (drilled hole 1.15±0.025 mm resp. 1.75±0.025 mm).
Based on our experiences regarding the production process of the PCB manufacturer we recommend a plated through hole configuration like shown in the above spreadsheet. To achieve the recommended plated through hole diameter, it is important to specify especially the drilled hole diameter of 1.15±0.025 mm resp. 1.75±0.025 mm to your PCB supplier.

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