Power output connectors for MicroTCA(TM) Technical characteristics

Technical characteristics

Design according	PICMG MTCA.0 R1.0 (RoHS compliance)
Total number of contacts	96
Power contact	24
Signal contact	72
Sequential contact engagement
1st	Power 4-11
2nd	Power 1-3, power 12-24
3rd	Signal A2-H9
4th	Signal A1
Working current
Power contact	9.3 A @ 80 % derating acc. IEC 60 512 and 70 °C ambient temperature and 30 °C temperature rise
Signal contact	1 A @ 80 % derating acc. IEC 60 512 and 70 °C ambient temperature
Initial contact resistance
Power contacts	< 5 mΩ
Signal contacts	< 25 mΩ
Initial insulation resistance	> 100 MΩ
Temperature range	-55°C ... +105 °C
Durability	200 mating cycles
Termination technique	Press-in termination
Mating force	145 N max.
Withdrawal force	110 N max.
Derating for MicroTCA™ power contacts Contact loading acc. MTCA.0
(1) Derating (2) Derating @ Imax. x 0.8      (acc. IEC 60 512-5-2)
Materials
Moulded parts	PBT, glass-fibre filled, UL 94-V0
Contacts	Copper Alloy
Contact surface
Power contacts:	selectively gold plated
Signal contacts:	selectively palladium nickel plated
Packaging	Tray packaging (other packaging on request)

  Recommended plated through hole specification

Tin plated PCB (HAL)	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Sn	5 – 15 μm
	Plated hole Ø	0.60 – 0.65 mm
Au / Ni plated PCB	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Ni	3 – 7 μm
	Au	0.05 – 0.12 μm
	Plated hole Ø	0.60 – 0.65 mm
Chemical tin plated PCB	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Sn	0.8 – 1.5 μm
	Plated hole Ø	0.60 – 0.65 mm
Silver plated PCB	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Ag	0.1 – 0.3 μm
	Plated hole Ø	0.60 – 0.65 mm
OSP copper plated PCB	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Plated hole Ø	0.60 – 0.65 mm
PCB board thickness: > 1.4 mm

The press-in zone of the :icroTCA ™ power connector is tested according to Telcordia/Bellcore GR 1217CORE Part7. It is approved to be used with a plated through hole according IEC 60352-5 with a diameter of 0.55±0.05 mm (drilled hole 0.64±0.01 mm).
Based on our experiences regarding the production process of the PCB manufacturer we recommend a plated through hole configuration like shown in the above spreadsheet. To achieve the recommended plated through hole diameter, it is important to specify especially the drilled hole diameter of 0.7±0.02 mm to your PCB supplier.

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