Plug Connector Technical characteristics for Plug Connectors for MicroTCA(TM) and AdvancedTCA® or MCH modules

Plug Connector Technical characteristics

Design according	PICMG MicroTCA.0 R1.0 PICMG AMC.0 R2.0 (RoHS compliance)
Number of contacts	170
Contact spacing	0.75 mm
Clearance and creepage distance between contacts	0.1 mm min.
Working current of power contacts as defined	~ 2.4 A @ 70 °C max. 30 °C temp. rise (PICMG requirement min. 1.52 A)
in AMC.0 spec., tested with HARTING
MicroTCATM backplane connector
Test voltage	80 Vr.m.s.
Working voltage typically	3.3 V; 5.0 V; 12.0 V
Initial contact resistance	25 mΩ max.
Initial insulation resistance	100 MΩ min.
Nominal differential impedance	100 Ω±10 %
Max. crosstalk @ 25 ps risetime Bottom route Adjacent 0.5 % Basic-to-extended (diagonal) 0.2 % Basic-to-extended (opposite) 0.7 % Multiline (five multi-aggressor differential pairs) 2.1 % max.
Propagation delay
Long contact side:	152 ps / 147 ps
Short contact side:	121 ps / 129 ps
Skew within differential pairs
Long contact side:	5 ps
Short contact side:	8 ps
Temperature range during reflow soldering	-55 °C … +105 °C 220 °C for 2 minutes 270 °C max. short-term
Durability as per AMC.0 specification	200 mating cycles in total
Termination technique	Solder termination (Pin in Hole Intrusive Reflow)
Pick-and-place-weight	< 7 g
Mating force	100 N max., typically 40 - 70 N
	(depending on backplane connector)
Withdrawal force	65 N max., typically 30 - 50 N
	(depending on backplane connector)
The mating and withdrawal force is highly depending on the mating half connector, but typically only 50 % to 70 % of the mating force of a PCB card edge.
Materials
Moulded parts	Liquid Crystal Polymer (LCP), UL 94-V0
Contacts	Copper alloy
Contact surface	Au over Ni
Packaging	Tray packaging (other packaging on request)
Plated through hole recommendations A Plated hole-Ø 0.55±0.05 mm B Hole-Ø 0.65±0.01 mm C Remaining pad 0.95 mm
Stencil recommendation
Each termination requires a solder paste volume of 0.5 mm³. Since the stencil can only provide fractions of this volume (0.29 mm³ at 0.15 mm stencil thickness), the remaining solder paste must be pressed into the plated through hole. For a nominal AMC card (1.6 mm PCB thickness, 0.55 mm plated hole diameter) the paste must penetrate the hole by 0.9 mm.

 

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